Liquid crystal display and manufacturing method thereof

ABSTRACT

A liquid crystal display, includes: a substrate; a gate line including a gate pad and a data line including a data pad, the gate and data lines being disposed on the substrate; a thin film transistor connected to the gate line and the data line; an organic layer disposed on the thin film transistor; a pixel electrode disposed on the organic layer; a first contact assistant disposed on the gate pad; a second contact assistant disposed on the data pad; a first insulating layer disposed on the pixel electrode; and a common electrode disposed on the first insulating layer, the common electrode overlapping with the pixel electrode. The common electrode includes first cutouts, the first insulating layer includes second cutouts, the plane shapes of the first and second cutouts are substantially the same, and the pixel electrode includes a polycrystalline transparent conductive material.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2013-0016584, filed on Feb. 15, 2013, which isincorporated by reference for all purposes as if set forth herein.

BACKGROUND

1. Field

Exemplary embodiments relate to display technology, and moreparticularly to, a liquid crystal display and a manufacturing methodthereof.

2. Discussion

Conventional liquid crystal displays typically display images byapplying voltages to field-generating electrodes that generate anelectric field in a liquid crystal (LC) layer that orients LC moleculesdisposed therein that, in turn, adjusts polarization of incident light.

Typically, liquid crystal displays are light weight, thin, andrelatively easy to manufacture; however, lateral visibility of suchdisplays may be lower than frontal visibility. This may be addressedthrough various liquid crystal arrangements and driving methods. Anothertechnique to realize a wide viewing angle involves forming a pixelelectrode and a common electrode on a same substrate. In this manner, aliquid crystal display of such a configuration may include at least oneof the pixel electrode and the common electrode including a plurality ofcutouts and a plurality of branch electrodes defined by the plurality ofcutouts. Accordingly, when forming the aforementioned field generatingelectrodes on the same display substrate, a number of photomasks (orreticles) are typically utilized. This increases manufacturing time,cost, and complexity.

Therefore, there is a need for an approach that provides more efficient,cost effective techniques to form a plurality of field generatingelectrodes on a display substrate.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the invention, and,therefore, it may contain information that does not form the prior artthat is already known in this country to a person of ordinary skill inthe art.

SUMMARY

Exemplary embodiments provide a manufacturing method to more efficientlyand cost-effectively form two field generating electrodes on the samedisplay substrate, as well as a liquid crystal display fabricatedtherefrom.

Additional aspects will be set forth in the detailed description whichfollows and, in part, will be apparent from the disclosure, or may belearned by practice of the invention.

According to exemplary embodiments, a liquid crystal display, includes:a substrate; a gate line including a gate pad, the gate line beingdisposed on the substrate; a data line including a data pad, the dataline being disposed on the substrate; a thin film transistor connectedto the gate line and the data line; an organic layer disposed on thethin film transistor; a pixel electrode disposed on the organic layer; afirst contact assistant disposed on the gate pad, a second contactassistant disposed on the data pad; a first insulating layer disposed onthe pixel electrode; and a common electrode disposed on the firstinsulating layer, the common electrode overlapping with the pixelelectrode. The common electrode includes first cutouts, the firstinsulating layer includes second cutouts, the plane shape of the firstcutouts and the second cutouts are substantially the same, and the pixelelectrode includes a polycrystalline transparent conductive material.

According to exemplary embodiments, a liquid crystal display, includes:a substrate; a gate line including a gate pad, the gate line beingdisposed on the substrate; a data line including a data pad, the dataline being disposed on the substrate; a thin film transistor connectedto the gate line and the data line; an organic layer disposed on thethin film transistor; a pixel electrode disposed on the organic layer; afirst contact assistant disposed on the gate pad; a second contactassistant disposed on the data pad; a first insulating layer disposed onthe pixel electrode; and a common electrode disposed on the firstinsulating layer, the common electrode overlapping with the pixelelectrode. The common electrode includes first cutouts. The edge of thefirst insulating layer is protruded from the edge of the commonelectrode.

According to exemplary embodiments, a method of manufacturing a liquidcrystal display, includes: forming a gate line including a gate pad anda data line including a data pad on a substrate; forming an organiclayer on the gate line and the data line; forming a pixel electrode onthe organic layer, a first contact assistant on the gate pad, and asecond contact assistant on the data pad; annealing the pixel electrode,the first contact assistant, and the second contact assistant to form apolycrystalline material; depositing a first layer including aninsulating material on the pixel electrode, the first contact assistant,and the second contact assistant; depositing a second layer including atransparent conductive material on the first layer; forming a firstphotosensitive film pattern including different thicknesses in differentregions thereof; etching the second layer and the first layer using thefirst photosensitive film pattern as an etching mask to expose at leasta portion of the first contact assistant and the second contactassistant; partially removing the first photosensitive film pattern toform a second photosensitive film pattern; and etching the second layerand the first layer using the second photosensitive film pattern as anetching mask to form a common electrode including first cutouts and afirst insulating layer including second cutouts.

According to exemplary embodiments, a method of manufacturing a liquidcrystal display, includes: forming a gate line including a gate pad anda data line including a data pad on a substrate; forming an organiclayer on the gate line and the data line; forming a pixel electrode onthe organic layer, a first contact assistant on the gate pad, and asecond contact assistant on the data pad; depositing a first layerincluding an insulating material on the pixel electrode, the firstcontact assistant, and the second contact assistant; depositing a secondlayer including a transparent conductive material on the first layer;forming a first photosensitive film pattern on the second layer; etchingthe second layer using the first photosensitive film pattern as anetching mask to form a common electrode including first cutouts;reflowing the first photosensitive film pattern to form a secondphotosensitive film pattern covering the first cutouts and an outer edgeof the common electrode; and etching the first layer using the secondphotosensitive film pattern as an etching mask to: form a firstinsulating layer protruded from the edge of the common electrode, andexpose at least a portion of the first contact assistant and the secondcontact assistant.

According to exemplary embodiments, a liquid crystal display includingtwo field generating electrodes formed on the same display substrate maybe more efficiently and cost-effectively manufactured.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theprinciples of the invention.

FIG. 1 is a layout view of a liquid crystal display, according toexemplary embodiments.

FIG. 2 is a cross-sectional view of the liquid crystal display of FIG. 1taken along sectional line II-II, according to exemplary embodiments.

FIG. 3 is a cross-sectional view of the liquid crystal display of FIG. 1taken along sectional line III-III, according to exemplary embodiments.

FIG. 4 is a cross-sectional view of the liquid crystal display of FIG. 1taken along sectional line IV-IV, according to exemplary embodiments.

FIGS. 5A-5C are respective cross-sectional views of a modified versionof the liquid crystal display of FIG. 1 taken along a similar sectionalline as sectional line V-V, according to exemplary embodiments.

FIG. 6 is a layout view of a portion of a liquid crystal display,according to exemplary embodiments.

FIG. 7 is a layout view of a partially formed liquid crystal display,according to exemplary embodiments.

FIG. 8 is a cross-sectional view of the partially formed liquid crystaldisplay of FIG. 7 taken along sectional line VIII-VIII, according toexemplary embodiments.

FIG. 9 is a cross-sectional view of the partially formed liquid crystaldisplay of FIG. 7 taken along sectional line IX-IX, according toexemplary embodiments.

FIG. 10 is a cross-sectional view of the partially formed liquid crystaldisplay of FIG. 7 taken along sectional line X-X, according to exemplaryembodiments.

FIGS. 11, 14, 17, 20, 23, and 26 are respective cross-sectional views ofthe liquid crystal display of FIG. 1 taken along sectional line II-II atvarious manufacturing stages, according to exemplary embodiments.

FIGS. 12, 15, 18, 21, 24, and 27 are respective cross-sectional views ofthe liquid crystal display of FIG. 1 taken along sectional line III-IIIat various manufacturing stages, according to exemplary embodiments.

FIGS. 13, 16, 19, 22, 25, and 28 are respective cross-sectional views ofthe liquid crystal display of FIG. 1 taken along sectional line IV-IV atvarious manufacturing stages, according to exemplary embodiments.

FIG. 29 is a layout view of a liquid crystal display, according toexemplary embodiments.

FIG. 30 is a cross-sectional view of the liquid crystal display of FIG.29 taken along sectional line XXX-XXX, according to exemplaryembodiments.

FIG. 31 is a cross-sectional view of the liquid crystal display of FIG.29 taken along sectional line XXXI-XXXI, according to exemplaryembodiments.

FIG. 32 is a cross-sectional view of the liquid crystal display of FIG.29 taken along sectional line XXXII-XXXII, according to exemplaryembodiments.

FIG. 33 is a layout view of a portion of a liquid crystal display,according to exemplary embodiments.

FIGS. 34, 38, 42, 46, 50, and 54 are respective cross-sectional views ofthe liquid crystal display of FIG. 29 taken along sectional line XXX-XXXat various manufacturing stages, according to exemplary embodiments.

FIGS. 35, 39, 43, 47, 51, and 55 are respective cross-sectional views ofthe liquid crystal display of FIG. 29 taken along sectional lineXXXI-XXXI at various manufacturing stages, according to exemplaryembodiments.

FIGS. 36, 40, 44, 48, 52, and 56 are respective cross-sectional views ofthe liquid crystal display of FIG. 29 taken along sectional lineXXXII-XXXII at various manufacturing stages, according to exemplaryembodiments.

FIGS. 37, 41, 45, 49, 53, and 57 are respective cross-sectional views ofthe liquid crystal display of FIG. 33 taken along sectional lineXXXVII-XXXVII at various manufacturing stages, according to exemplaryembodiments.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers and/or sections, theseelements, components, regions, layers and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer or section from another region, layer orsection. Thus, a first element, component, region, layer or sectiondiscussed below could be termed a second element, component, region,layer or section without departing from the teachings of the presentdisclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and/or the like, may be used herein for descriptive purposes,and thereby, to describe one element or feature's relationship toanother element(s) or feature(s) as illustrated in the drawings.Spatially relative terms are intended to encompass differentorientations of an apparatus in use or operation in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises” and/or “comprising,” when used in thisspecification, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a layout view of a liquid crystal display, according toexemplary embodiments. FIG. 2 is a cross-sectional view of the liquidcrystal display of FIG. 1 taken along sectional line II-II. FIG. 3 is across-sectional view of the liquid crystal display of FIG. 1 taken alongsectional line III-III. FIG. 4 is a cross-sectional view of the liquidcrystal display of FIG. 1 taken along sectional line IV-IV.

Referring to FIGS. 1-4, a liquid crystal display, according to exemplaryembodiments, includes a lower panel 100, an upper panel 200 facing thelower panel 100, and a liquid crystal layer 3 disposed therebetween.

The lower panel 100 will now be described in more detail.

Lower panel 100 includes a gate conductor including a plurality of gatelines 121 formed on a first insulating substrate 110. The firstinsulating substrate 110 may be formed of (or otherwise include)transparent glass, plastics, and the like.

Each gate line 121 includes a plurality of gate electrodes 124, and agate pad 129 including a wide area to connect with another layer or anexternal driving circuit. The gate lines 121 may be made of any suitablematerial, such as, for example, an aluminum-based metal (e.g., aluminum(Al) or an Al alloy), a silver-based metal, (e.g., silver (Ag) or a Agalloy), a copper-based metal (e.g., copper (Cu) or a Cu alloy), amolybdenum-based metal (e.g., molybdenum (Mo) or a Mo alloy), achromium-based metal (e.g., chromium (Cr) or a Cr alloy), atantalum-based metal (e.g., tantalum (Ta) or a Ta alloy), atitanium-based metal (e.g., titanium (Ti) or a Ti alloy), and/or thelike. However, the gate lines 121 may be multilayered structuresincluding at least two conductive layers of different physicalproperties.

A gate insulating layer 140 formed of any suitable material, such as,for instance, silicon nitride (SiNx), silicon oxide (SiOx), and thelike, may be formed on the gate conductors 121, 124, and 129. However,the gate insulating layer 140 may be a multilayered structure includingat least two insulating layers of different physical properties.

A plurality of semiconductors 154 made of (or otherwise including)amorphous silicon, polysilicon, and the like, is formed on the gateinsulating layer 140. It is contemplated, however, that thesemiconductors 154 may be oxide-based semiconductors.

Ohmic contacts 163 and 165 may be formed on the semiconductors 154. Theohmic contacts 163 and 165 may made of any suitable material, such as,for instance, n+ hydrogenated amorphous silicon, in which an n-typeimpurity, such as, for example, phosphorus is doped at a highconcentration. As another example, the ohmic contacts 163 and 165 may beformed of silicide. In exemplary embodiments, the ohmic contacts 163 and165 may form a pair of ohmic contacts, which are disposed on eachsemiconductor 154. In the manner, when the semiconductors 154 are oxidesemiconductors, the ohmic contacts 163 and 165 may be omitted.

A data conductor including a plurality of data lines 171 including aplurality of source electrodes 173 and a plurality of drain electrodes175 may be formed on the ohmic contacts 163 and 165, and, thereby,disposed on the gate insulating layer 140. Each data line 171 mayinclude a data pad 179 including a wide area to connect to another layeror an external driving circuit. Each data line 171 transports a datasignal and extends in substantially a first (e.g., vertical or column)direction. In this manner, the data lines 171 cross the gate lines 121,which extend in substantially a second (e.g., horizontal or row)direction. It is contemplated; however, that the directions of extensionof the gate and data lines 121 and 171 may be swapped, such that thegate lines 121 extend substantially in the second direction and the datalines extend in substantially the first direction. Any other suitableconfiguration may be utilized.

According to exemplary embodiments, the data lines 171 may include firstand second bent portions respectively bent in the second direction. Thisbent shape may facilitate increased transmittance of the liquid crystaldisplay and may repetitively occur in association with each pixel of theliquid crystal display. In this manner, the first and second bentportions may meet each other in a middle region of each correspondingpixel to form a sideways V shape. In this manner, the second bentportion may be bent to form a determined angle with the first bentportion. While not illustrated, the data lines 171 may include a thirdbent portion bent to form a determined angle with the first and secondbent portions. In this manner, the third bent portion may form asideways V shape that is protruded from the sideways V shape of thefirst and second bent portions, such as illustrated in association withcutouts 271 of common electrode 270.

The first and second bent portions of the data line 171 may berespectively bent at about ±7° from an imaginary vertical reference lineperpendicular to the second direction. The third bent portion, which maybe disposed in the middle region of a pixel, may include correspondingportions that are further bent at about ±7° to about ±15° with respectto the first and second bent portions.

In exemplary embodiments, the source electrodes 173 are portions of thedata lines 171, and may be disposed on the same layer as the data lines171. The drain electrodes 175 extend substantially parallel to thesource electrodes 173. Accordingly, the drain electrodes 175 areparallel to a portion of the data lines 171.

According to exemplary embodiments, a gate electrode 124, a sourceelectrode 173, and a drain electrode 175 form a switching element, e.g.,a thin film transistor (TFT), in conjunction with a semiconductor 154. Achannel of the TFT may be formed in or disposed on the semiconductor 154between the source electrode 173 and the drain electrode 175.

The liquid crystal display, according to exemplary embodiments, mayinclude the source electrodes 173 disposed on the same layer as the datalines 171. To this end, the drain electrodes 175, which may extendparallel to a portion of the data line 171, may increase a width of theTFT. In this manner, however, the area of the data conductor may not beincreased, which may increase an opening (or aperture) ratio of theliquid crystal display. It is also contemplated that the sourceelectrodes 173 and the drain electrodes 175 may be differently shaped.

In exemplary embodiments, the data lines 171 and the drain electrodes175 may be made of any suitable material, e.g., refractory metal, suchas, for instance, Mo, Cr, Ta, Ti, etc., or an alloy thereof. The datalines 171 and/or the drain electrodes 175 may be multilayered structuresincluding, for example, a refractory metal layer (not shown) and a lowresistance conductive layer (not shown) formed on one another. Forinstance, the multilayered structure may include a double layerstructure including, for example, a Cr or Mo (or an alloy thereof) first(or lower) layer and an Al (or an alloy thereof) second (or upper)layer, a triple layer structure including, for instance, a Mo (or analloy thereof) lower layer, an Al (or an alloy thereof) middle layer,and a Mo (or an alloy thereof) upper layer. It is contemplated, however,that the data lines 171 and the drain electrodes 175 may be made of anysuitable conductive material and/or any suitable number of layers.

A first passivation layer 180 x is disposed on the data conductors 171,173, 175, and 179, the gate insulating layer 140, and exposed portionsof the semiconductors 154. The first passivation layer 180 x may includean organic insulating material, an inorganic insulating material, and/orthe like.

An organic layer 80 is disposed on the first passivation layer 180 x.The organic layer 80 may be thicker than the first passivation layer 180x and may have a flat surface, such as a flat upper surface.

A first thickness H1 of a portion of the organic layer 80 disposed in adisplay area where a plurality of pixels are disposed to display animage may be larger than a second thickness H2 of a portion of theorganic layer 80 disposed in a peripheral area where the gate pad 129 orthe data pad 179 are disposed. It is contemplated that the organic layer80 may be omitted.

According to exemplary embodiments, the organic layer 80, the firstpassivation layer 180 x, and the gate insulating layer 140 include afirst contact hole 186 exposing the gate pad 129. The organic layer 80and the first passivation layer 180 x also include a second contact hole187 exposing the data pad 179, as well as a third contact hole 185exposing the drain electrode 175.

A plurality of pixel electrodes 191 may be formed on the organic layer80. The pixel electrodes 191 include a curved edge that is substantiallyparallel to the first bent portion and the second bent portion of thedata line 171.

A first contact assistant 96 covering the gate pad 129 exposed throughthe first contact hole 186 may be formed on the first passivation layer180 x, and a second contact assistant 97 covering the data pad 179exposed through the second contact hole 187 may be formed on the firstpassivation layer 180 x. The first contact assistant 96 and the secondcontact assistant 97 are connected to the gate pad 129 and the data pad179 through the first and second contact holes 186 and 187,respectively. The first and second contact assistants 96 and 97 mayenhance adhesion of external devices (not shown) with the gate pad 129and data pad 179. The first and second contact assistants 96 and 97 mayalso serve to protect the gate pad 129 and the data pad 179.

In exemplary embodiments, the pixel electrodes 191, the first contactassistant 96, and the second contact assistant 97 may be formed of anysuitable transparent conductive material, such as, for instance,polycrystalline aluminum zinc oxide (AZO), gallium zinc oxide (GZO),indium tin oxide (ITO), indium zinc oxide (IZO), etc. It is alsocontemplated that one or more conductive polymers (ICP) may be utilized,such as, for example, polyaniline, poly(3,4-ethylenedioxythiophene)poly(styrenesulfonate) (PEDOT:PSS), etc.

Each pixel electrode 191 is physically and electrically connected to thedrain electrode 175 through the third contact hole 185 formed in theorganic layer 80 and the first passivation layer 180 x. As such, eachpixel electrode 191 is configured to receive a voltage (e.g., datavoltage) from the drain electrode 175.

A second passivation layer 180 y may be formed on the pixel electrodes191. A common electrode 270 may be formed on the second passivationlayer 180 y. The common electrode 270 may be made of any suitabletransparent conductive material, such as, for example, AZO, GZO, ITO,IZO, etc. It is also contemplated that one or more conductive polymers(ICP) may be utilized, such as, for example, polyaniline,poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) (PEDOT:PSS),etc.

In exemplary embodiments, the second passivation layer 180 y and thecommon electrode 270 disposed on the second passivation layer 180 y mayexhibit substantially the same plane shape. The second passivation layer180 y and the common electrode 270 may be disposed in the display areaincluding a plurality of pixels, but may not be disposed in theperipheral area where the gate pads 129 and the data pads 179 areformed.

The common electrode 270 may include a plurality of first cutouts 271,and the second passivation layer 180 y has a plurality of second cutouts181. The first cutouts 271 of the common electrode 270 and the secondcutouts 181 of the passivation layer 180 y may form substantially thesame plane shape.

Although not shown, an alignment layer may be coated on the commonelectrode 270 and the pixel electrodes 191 exposed by the second cutouts181 of the second passivation layer 180 y and the first cutouts 271 ofthe common electrode 270. The alignment layer may be a horizontalalignment layer that is rubbed in a determined direction. It is alsocontemplated, however, that the alignment layer may additionally (oralternatively) include an optical reaction material that is opticallyaligned to prealign liquid crystal molecules of the liquid crystal layer3.

The upper display panel 200 will now be described in more detail.

A light blocking member 220 may be formed on a second insulatingsubstrate 210 made of (or otherwise include) any suitable material,e.g., transparent glass, plastic, etc. The light blocking member 220 mayalso be referred to as a black matrix. In this manner, the lightblocking member 220 is configured to prevent light leakage.

A plurality of color filters 230 may be formed on the second substrate210. The color filters 230 may overlap with at least a portion of thelight blocking member 220.

An overcoat 250 may be formed on the color filters 230 and the lightblocking member 220. The overcoat 250 may be made of (or otherwiseinclude) any suitable material, such as, for instance, an (organic)insulator. As such, the overcoat 250 may prevent exposure of the colorfilters 230 to contaminants, as well as provide a flat surface. It isalso contemplated that the overcoat 250 may be omitted. Further, analignment layer (not shown) may be disposed on the overcoat 250 and maybe similar to the alignment layer (not illustrated) that may be disposedon the common electrode 270 and the pixel electrodes 191 exposed by thesecond cutouts 181 of the second passivation layer 180 y and the firstcutouts 271 of the common electrode 270.

According to exemplary embodiments, the liquid crystal layer 3 includesa nematic liquid crystal material having positive dielectric anisotropy.Liquid crystal (LC) molecules of the liquid crystal layer 3 may bearranged so that a long axis direction thereof is parallel to the upperand lower panels 100 and 200.

During operation, the pixel electrodes 191 receive data voltages fromthe drains electrodes 175, and the common electrode 270 receives acommon voltage having a determined magnitude from a common voltageapplication portion (described in more detail in association with FIG.6), which may be disposed outside of the display region, e.g., in theperipheral area. In this manner, the liquid crystal molecules of theliquid crystal layer 3 disposed on the two field generating electrodes191 and 270 may be rotated in a direction parallel to a direction of animposed electric field when the electric field is generated inassociation with the pixel electrode 191 and the common electrode 270.As previously described, based on the rotational direction of the liquidcrystal molecules, the polarization of incident light passing throughthe liquid crystal layer 3 may be changed to facilitate the display ofimages.

According to exemplary embodiments, the second passivation layer 180 ydisposed on the pixel electrodes 191 and the common electrode 270disposed on the second passivation layer 180 y include substantially thesame plane shape. This may result from the common electrode 270including the first cutouts 271, the second passivation layer 180 yincluding the second cutouts 181, and the first cutouts 271 and thesecond cutouts 181 including substantially the same plane shape. Assuch, the second passivation layer 180 y and the common electrode 270may be formed together using one photomask (or reticle), which mayreduce manufacturing costs, time, and complexity.

As seen in FIGS. 1-4, the organic layer 80 may be disposed on the firstpassivation layer 180 x of the lower panel 100, and the upper panel 200may include the color filter 230 and the light blocking member 220. Itis contemplated, however, that the color filters 230 may be disposed onthe lower panel 100 instead of (or in place of) the organic layer 80,and, as such, the upper panel 200 may not include the color filters 230.In this manner, the light blocking member 220 may also be disposed onthe lower panel 100 rather than the upper panel 200. Such aconfiguration is described in more detail in association with FIGS.5A-5C.

FIG. 5A-FIG. 5C are respective cross-sectional views of a modifiedversion of the liquid crystal display of FIG. 1 taken along sectionalline V-V, according to exemplary embodiments. It is noted that theliquid crystal displays of FIGS. 5A-5C are substantially similar to theliquid crystal display of FIGS. 1-4, and, as such, differences betweenthese liquid crystal displays are described below. In other words, toavoid obscuring exemplary embodiments described herein, duplicativedescriptions of similarly configured features are omitted.

Referring to FIG. 5A, the light blocking member 220 is disposed on thefirst passivation layer 180 x of the lower panel 100. The light blockingmember 220 is disposed in a region corresponding to the gate lines 121and the data lines 171. The color filters 230 are disposed on the firstpassivation layer 180 x and at least a portion of the light blockingmember 220. A capping layer 180 is disposed on the light blocking member220 and the color filters 230. The capping layer 180 prevents a pigmentof the light blocking member 220 and the color filters 230 from flowinginto (or otherwise contaminating) the liquid crystal layer 3.

The pixel electrodes 191 are disposed on the capping layer 180. Thesecond passivation layer 180 y and the common electrode 270 are disposedon the pixel electrodes 191. The common electrode 270 and the secondpassivation layer 180 y respectively include the first cutouts 271 andthe second cutouts 181 that may include substantially the same planeshape.

Accordingly, the light blocking member 220 and the color filters 230 arenot disposed on the upper panel 200.

Referring to FIG. 5B, the color filters 230 are disposed on the firstpassivation layer 180 x of the lower panel 100. The color filters 230are disposed in a region corresponding to a display area of each of thepixel electrodes 191. The light blocking member 220 is disposed on thefirst passivation layer 180 x and at least a portion of the color filter230. The light blocking member 220 is disposed in a region correspondingto a non-display area associated with the gate lines 121 and the datalines 171. The capping layer 180 is disposed on the light blockingmember 220 and the color filters 230. As previously noted, the cappinglayer 180 prevents a pigment of the light blocking member 220 and thecolor filters 230 from flowing into (or otherwise contaminating) theliquid crystal layer 3.

The pixel electrodes 191 are disposed on the capping layer 180. Thesecond passivation layer 180 y and the common electrode 270 are disposedon the pixel electrode 191. The common electrode 270 and the secondpassivation layer 180 y respectively include the first cutouts 271 andthe second cutouts 181 that may include substantially the same planeshape.

Accordingly, the light blocking member 220 and the color filters 230 arenot disposed on the upper panel 200.

Referring to FIG. 5C, the liquid crystal display is substantiallysimilar to the liquid crystal display of FIG. 5A, but the liquid crystaldisplay of FIG. 5C does not include the capping layer 180. As such, thelight blocking member 220 is disposed on the first passivation layer 180x of the lower panel 100. The light blocking member 220 is disposed in aregion corresponding to a non-display area associated with the gatelines 121 and the data lines 171. The light blocking member 220 isdisposed on the first passivation layer 180 x and at least a portion ofcolor filters 230. While not illustrated, the color filters 230 may bedisposed on the first passivation layer 180 x and at least a portion ofthe light blocking member 220.

The pixel electrodes 191 are disposed on the color filter 230. Thesecond passivation layer 180 y and the common electrode 270 are disposedon the pixel electrode 191. The common electrode 270 and the secondpassivation layer 180 y respectively include the first cutouts 271 andthe second cutouts 181 that include substantially the same plane shape.

Accordingly, the light blocking member 220 and the color filters 230 arenot disposed on the upper panel 200.

An exemplary plane shape of the common electrode 270 will now bedescribed in more detail with reference to FIG. 6. FIG. 6 is a layoutview of a portion of a liquid crystal display, according to exemplaryembodiments.

Referring to FIG. 6, the liquid crystal display includes a display areaDA including a plurality of pixels and a peripheral area PA near thedisplay area DA.

The common electrode 270 including the plurality of first cutouts 271disposed in association with each pixel area is disposed in the displayarea DA. The first cutouts 271, which are disposed in association witheach pixel area, are also spatially formed in correspondence with eachpixel electrode 191 disposed in each respective pixel area.

A common voltage application unit 50 applying the common voltage to thecommon electrode 270 is disposed in the peripheral area PA. A connection27 is disposed between the common voltage application unit 50 and thecommon electrode 270. The common electrode 270 and the connection 27 maybe simultaneously formed in the same layer. As shown, the commonelectrode 270 may include substantially the same plane shape as theunderlying second passivation layer 180 y.

An exemplary manufacturing method to fabricate an exemplary liquidcrystal display will now be described in more detail with reference toFIGS. 7-28, as well as in conjunction with FIGS. 1-4.

FIG. 7 is a layout view of a partially formed liquid crystal display,according to exemplary embodiments. FIG. 8 is a cross-sectional view ofthe partially formed liquid crystal display of FIG. 7 taken alongsectional line VIII-VIII. FIG. 9 is a cross-sectional view of thepartially formed liquid crystal display of FIG. 7 taken along sectionalline IX-IX. FIG. 10 is a cross-sectional view of the partially formedliquid crystal display of FIG. 7 taken along sectional line X-X. FIGS.11, 14, 17, 20, 23, and 26 are respective cross-sectional views of theliquid crystal display of FIG. 1 taken along sectional line II-II atvarious manufacturing stages, according to exemplary embodiments. FIGS.12, 15, 18, 21, 24, and 27 are respective cross-sectional views of theliquid crystal display of FIG. 1 taken along sectional line III-III atvarious manufacturing stages, according to exemplary embodiments. FIGS.13, 16, 19, 22, 25, and 28 are respective cross-sectional views of theliquid crystal display of FIG. 1 taken along sectional line IV-IV atvarious manufacturing stages, according to exemplary embodiments.

As shown in FIGS. 7-10, a plurality of gate lines 121 including aplurality of gate electrodes 124 and a plurality of gate pads 129 areformed on the first insulation substrate 110. A gate insulating layer140 is formed on the gate lines 121. A plurality of semiconductors 154,a plurality of ohmic contacts 163 and 165, a plurality of data lines 171including a plurality of source electrodes 173 and a plurality of datapads 179, and a plurality of drain electrodes 175 are formed on the gateinsulating layer 140. The first passivation layer 180 x and an organiclayer 80 are formed on the data lines 171 and the drain electrodes 175.The organic layer 80 is not formed where the first contact holes 186,the second contact holes 187, and the third contact holes 185 areformed.

According to exemplary embodiments, the organic layer 80 may be thecolor filter 230, and the light blocking member 220 may be formed on orunder the color filter 230. The portion of the organic layer 80 disposedin association with a display area where a plurality of pixels aredisposed to display an image may be of a first thickness H1, which islarger than a second thickness H2 of the organic layer 80 disposed inassociation with a peripheral area, where the gate pads 129 or the datapads 179 are disposed. As previously mentioned, the organic layer 80 maybe omitted.

The first contact holes 186 exposing the gate pads 129 are formed in thefirst passivation layer 180 x and the gate insulating layer 140 disposedin the region not covered by the organic layer 80. The second contactholes 187 exposing the data pads 179 and the third contact holes 185exposing the drain electrodes 175 are formed in the first passivationlayer 180 x disposed in the region not covered by the organic layer 80.

A plurality of pixel electrodes 191 disposed on the organic layer 80 andconnected to the drain electrodes 175 through the third contact holes185 is formed. The first contact assistants 96 covering the gate pads129 exposed through the first contact holes 186 are formed on the firstpassivation layer 180 x, and the second contact assistants 97 coveringthe data pads 179 exposed through the second contact holes 187 areformed on the first passivation layer 180 x. As previously noted, thepixel electrodes 191 and the first and second contact assistants 96 and97 may be formed of any suitable transparent conductor.

As shown in FIGS. 1-4, the second passivation layer 180 y and the commonelectrode 270 are formed on the pixel electrode 191. This will bedescribed in more detail in association with FIGS. 11-28.

As shown in FIGS. 11-13, the first substrate 110 including the pixelelectrodes 191 and the first and second contact assistants 96 and 97 isannealed to form a polycrystalline transparent conductor including thepixel electrodes 191, the first contact assistant 96, and the secondcontact assistant 97, such as AZO, GZO, ITO, IZO, etc.

Referring to FIGS. 14-16, a first layer 10 made of (or otherwiseincluding) silicon nitride (SiNx) or silicon oxide (SiOx) is depositedon the first substrate 110 including the pixel electrodes 191 and thefirst and second contact assistants 96 and 97, each of which may be madeof the polycrystalline AZO, GZO, ITO, IZO, etc. A second layer 20 madeof the transparent conductor, such as AZO, GZO, ITO, IZO, etc., isdeposited on the first layer 10. A first photosensitive film 400 isdeposited on the second layer 20.

Adverting to FIGS. 17-19, the first photosensitive film 400 is exposedand developed to form a first photosensitive film pattern includingvarious portions (e.g., portions 400 a and 400 b) of differentthicknesses depending on the respective positions of the portions.

Any suitable method to form the different thicknesses of thephotosensitive film 400 may be utilized. For example, a photomask may beformed with a translucent area, a light transmitting area, and a lightblocking area. The translucent area may be provided with a slit patternor a lattice pattern, or as a thin film having medium transmittance orthickness. When provided including a slit pattern, the slit width or thespace between slits may be smaller than the resolution of the exposureequipment used in the photolithography process. Accordingly, when thephotosensitive film 400 is exposed and developing use the photomask, thevarious portions (e.g., portions 400 a and 400 b) of differentthicknesses may be provided. As another example, a reflowablephotosensitive film may be formed. For instance, a thin portion may beformed by making a photosensitive film flow into a region where thephotosensitive film is not present after forming the reflowablephotosensitive film with a general exposure mask including a lighttransmitting area and a light blocking area. This may reduce the numberof photolithography processes, and, thereby, may also reduce thecomplexity and cost of the manufacturing method.

According to exemplary embodiments, the photosensitive film pattern 400a of a first (e.g., thicker) thickness may be disposed in a region wherethe common electrode 270 and the second passivation layer 180 y areformed. The photosensitive film pattern 400 b of a second (e.g.,thinner) thickness may be disposed in a region where the first cutouts271 and the second cutouts 181 are formed in the common electrode 270and the second passivation layer 180 y. It is noted that thephotosensitive film pattern may not be formed in the peripheral areawhere the gate pads 129 and the data pads 179 are disposed.

With reference to FIGS. 20-22, the second layer 20 and the first layer10 may be sequentially etched using the photosensitive film patterns(e.g., patterns 400 a and 400 b) as an etching mask to remove the firstlayer 10 and the second layer 20 in the peripheral area where the gatepads 129 and the data pads 179 are disposed. In this manner, the firstcontact assistants 96 and the second contact assistants 97 disposed onthe gate pads 129 and the data pads 179 are exposed.

As shown in FIGS. 23-25, the first photosensitive film patterns (e.g.,patterns 400 a and 400 b) may be ashed to decrease the thickness of thephotosensitive film pattern 400 a of the thicker thickness andsimultaneously remove the photosensitive film pattern 400 b of thethinner thickness. In this manner, the ashing process may form a secondphotosensitive film pattern 400 c.

Adverting to FIGS. 26-28, the second layer 20 and the first layer 10 aresequentially etched using the second photosensitive film pattern 400 cas an etching mask, which forms the common electrode 270 including theplurality of first cutouts 271 and the second passivation layer 180 yincluding the plurality of second cutouts 181. In this manner, thesecond layer 20 and the first layer 10 are removed from the peripheralarea where the gate pads 129 and the data pads 179 are disposed. Thefirst and second contact assistants 96 and 97 are annealed to form apolycrystalline transparent conductive material. Since the second layer20 is not a polycrystalline transparent conductive material, the firstand second contact assistants 96 and 97 are not etched when the secondlayer 20 is etched.

The second photosensitive film pattern 400 c is removed to form thelower panel 100.

As described above, after forming the lower panel 100, the upper panel200 is formed. The liquid crystal layer 3 is injected between the lowerand upper panels 100 and 200, and, thereby, forming the liquid crystaldisplay shown in FIGS. 1-4.

According to exemplary embodiments, the common electrode 270 and thesecond passivation layer 180 y may be simultaneously formed, which maydecrease manufacturing time, cost, and complexity.

FIG. 29 is a layout view of a liquid crystal display, according toexemplary embodiments. FIG. 30 is a cross-sectional view of the liquidcrystal display of FIG. 29 taken along sectional line XXX-XXX. FIG. 31is a cross-sectional view of the liquid crystal display of FIG. 29 takenalong sectional line XXXI-XXXI. FIG. 32 is a cross-sectional view of theliquid crystal display of FIG. 29 taken along sectional lineXXXII-XXXII. The liquid crystal display of FIGS. 29-32 is substantiallysimilar to the liquid crystal display of FIGS. 1-4, and, as such,differences between these liquid crystal displays are described below.In other words, to avoid obscuring exemplary embodiments describedherein, duplicative descriptions of similarly configured features areomitted.

Referring to FIGS. 29-32, a liquid crystal display, according toexemplary embodiments, includes a lower panel 100, an upper panel 200facing the lower panel 100, and a liquid crystal layer 3 disposedtherebetween.

The lower panel 100 will now be described in more detail.

Gate conductors including the gate lines 121, the gate electrodes 124,and the gate pads 129 are formed on the first insulating substrate 110,which may be formed of any suitable material, such as, for instance,transparent glass, plastics, or the like.

The gate insulating layer 140, which may be formed of any suitablematerial, e.g., silicon nitride (SiNx), silicon oxide (SiOx), or thelike, may be formed on the gate conductors 121, 124, and 129.

The semiconductors 154 made of any suitable material, e.g., amorphoussilicon, polysilicon, or the like, may be formed on the gate insulatinglayer 140. The semiconductors 154 may include an oxide semiconductor.

The ohmic contacts 163 and 165 may be formed on the semiconductors 154.When the semiconductors 154 include the oxide semiconductor, the ohmiccontacts 163 and 165 may be omitted.

The data conductors, including the data lines 171 including the sourceelectrodes 173 and the data pads 179, and the drain electrodes 175, areformed on the ohmic contacts 163 and 165 and the gate insulating layer140.

The first passivation layer 180 x is disposed on the data conductors171, 173, 175, and 179, the gate insulating layer 140, and the exposedportions of the semiconductors 154. The first passivation layer 180 xmay include any suitable material, such as an organic insulatingmaterial, an inorganic insulating material, and/or the like.

An organic layer 80 is disposed on the first passivation layer 180 x.The organic layer 80 may be thicker than the first passivation layer 180x and may have a flat surface, such as a flat upper surface.

The first thickness H1 of a portion of the organic layer 80 disposed ina display area where a plurality of pixels are disposed to display animage may be larger than the second thickness H2 of a portion of theorganic layer 80 disposed in a peripheral area where the gate pads 129or the data pads 179 are disposed. It is contemplated that the organiclayer 80 may be omitted.

According to exemplary embodiments, the organic layer 80, the firstpassivation layer 180 x, and the gate insulating layer 140 include thefirst contact holes 186 exposing the gate pads 129. The organic layer 80and the first passivation layer 180 x also include the second contactholes 187 exposing the data pads 179, as well as include the thirdcontact holes 185 exposing the drain electrodes 175.

The pixel electrodes 191 may be disposed on the organic layer 80.

The first contact assistants 96 covering the gate pads 129 exposedthrough the first contact holes 186 may be disposed on the firstpassivation layer 180 x, and the second contact assistants 97 coveringthe data pads 179 exposed through the second contact holes 187 may bedisposed on the first passivation layer 180 x.

The first contact assistants 96 and the second contact assistants 97 areconnected to the gate pads 129 and the data pads 179 through the firstand second contact holes 186 and 187, respectively.

In exemplary embodiments, the pixel electrodes 191 are physically andelectrically connected to the drain electrodes 175 through the thirdcontact holes 185 formed in the organic layer 80 and the firstpassivation layer 180 x. As such, the pixel electrodes are configured toreceive data voltages from the drain electrodes 175.

The second passivation layer 180 y may be formed on the pixel electrodes191. A common electrode 270 may be formed on the second passivationlayer 180 y. The common electrode 270 may be made of any suitabletransparent conductive material, such as, for example, AZO, GZO, ITO,IZO, etc. It is also contemplated that one or more conductive polymers(ICP) may be utilized, such as, for example, polyaniline,poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) (PEDOT:PSS),etc.

In exemplary embodiments, the second passivation layer 180 y and thecommon electrode 270 may be disposed in the display area including aplurality of pixels, but may not be disposed in the peripheral areawhere the gate pads 129 and the data pads 179 are formed. The commonelectrode 270 includes a plurality of the first cutouts 271.

According to exemplary embodiments, the edge of the second passivationlayer 180 y may be protruded from the edge of the common electrode 270.For instance, the edge of the second passivation layer 180 y may beprotruded from the edge of the common electrode 270 by about 2 μm toabout 3 μm. In exemplary embodiments, the edge of the second passivationlayer 180 y may be protruded from the edge of the common electrode 270by more than half the width of the first cutout 271.

Although not shown, an alignment layer may be coated on the commonelectrode 270 and the pixel electrodes 191 exposed by the second cutouts181 of the second passivation layer 180 y and the first cutouts 271 ofthe common electrode 270. The alignment layer may be a horizontalalignment layer that is rubbed in a determined direction. It is alsocontemplated that the alignment layer may additionally (oralternatively) include an optical reaction material that is opticallyaligned to prealign liquid crystal molecules of the liquid crystal layer3.

The upper display panel 200 will now be described in more detail.

The light blocking member 220 and a plurality of color filters 230 maybe formed on the second insulating substrate 210 made of (or otherwiseincluding) any suitable material, e.g., transparent glass, plastic, etc.

An overcoat 250 may be formed on the color filters 230 and the lightblocking member 220. Further, an alignment layer (not shown) may bedisposed on the overcoat 250 and may be similar to the alignment layer(not illustrated) that may be disposed on the common electrode 270 andthe pixel electrodes 191 exposed by the second cutouts 181 of the secondpassivation layer 180 y and the first cutouts 271 of the commonelectrode 270.

According to exemplary embodiments, the liquid crystal layer 3 includesa nematic liquid crystal material having positive dielectric anisotropy.The liquid crystal molecules of the liquid crystal layer 3 may bearranged so that a long axis direction thereof is parallel to the upperand lower panels 100 and 200.

During operation, the pixel electrodes 191 receive data voltages fromthe drain electrodes 175, and the common electrode 270 receives a commonvoltage having a determined magnitude from a common voltage applicationportion (described in more detail in association with FIG. 33), whichmay be disposed outside of the display region, e.g., in the peripheralarea. In this manner, the liquid crystal molecules of the liquid crystallayer 3 disposed on the two field generating electrodes 191 and 270 maybe rotated in a direction parallel to a direction of an imposed electricfield when the electric field is generated in association with the pixelelectrode 191 and the common electrode 270. As previously described,based on the rotational direction of the liquid crystal molecules, thepolarization of incident light passing through the liquid crystal layer3 may be changed to facilitate the display of images.

According to exemplary embodiments, the second passivation layer 180 yand the common electrode 270 may be formed together by using onephotomask (or reticle), which may reduce manufacturing costs, time, andcomplexity.

As seen in FIGS. 29-32, the organic layer 80 may be disposed on thefirst passivation layer 180 x of the lower panel 100, and the upperpanel 200 may include the color filter 230 and the light blocking member220. It is contemplated, however, that the color filters 230 may bedisposed on the lower panel 100 instead of (or in place of) the organiclayer 80, and, as such, the upper panel 200 may not include the colorfilters 230. In this manner, the light blocking member 220 may also bedisposed on the lower panel 100 rather than the upper panel 200. Such aconfiguration was previously described in more detail in associationwith FIGS. 5A-5C.

An exemplary plane shape of the common electrode 270 will now bedescribed in more detail with reference to FIG. 33. FIG. 33 is a layoutview of a portion of a liquid crystal display, according to exemplaryembodiments.

Referring to FIG. 33, the liquid crystal display includes a display areaDA including a plurality of pixels and a peripheral area PA near thedisplay area DA.

The common electrode 270 including a plurality of first cutouts 271disposed in association with each pixel area is disposed in the displayarea DA. The first cutouts 271, which are disposed in association witheach pixel area, are also formed in correspondence with each pixelelectrode 191 disposed in each respective pixel area.

A common voltage application unit 50 applying the common voltage to thecommon electrode 270 is disposed in the peripheral area PA. A connection27 is disposed between the common voltage application unit 50 and thecommon electrode 270. The common electrode 270 and the connection 27 maybe simultaneously formed in the same layer.

According to exemplary embodiments, the second passivation layer 180 ydisposed under the common electrode 270 may include a protrusion 81protruded from the edge of the common electrode 270. The protrusion 81of the second passivation layer 180 y may be protruded from the edge ofthe common electrode 270 by about 2 μm to about 3 μm. For instance, thewidth of the protrusion 81 of the second passivation layer 180 y may bemore than half the width of the first cutout 271.

An exemplary manufacturing method to fabricate an exemplary liquidcrystal display will now be described in more detail with reference toFIGS. 34-57, as well as in conjunction with FIGS. 29-32.

FIGS. 34, 38, 42, 46, 50, and 54 are respective cross-sectional views ofthe liquid crystal display of FIG. 29 taken along sectional line XXX-XXXat various manufacturing stages, according to exemplary embodiments.FIGS. 35, 39, 43, 47, 51, and 55 are respective cross-sectional views ofthe liquid crystal display of FIG. 29 taken along sectional lineXXXI-XXXI at various manufacturing stages, according to exemplaryembodiments. FIGS. 36, 40, 44, 48, 52, and 56 are respectivecross-sectional views of the liquid crystal display of FIG. 29 takenalong sectional line XXXII-XXXII at various manufacturing stages,according to exemplary embodiments. FIGS. 37, 41, 45, 49, 53, and 57 arerespective cross-sectional views of the liquid crystal display of FIG.29 taken along sectional line XXXVII-XXXVII at various manufacturingstages, according to exemplary embodiments.

As shown in FIGS. 34-37, a plurality of gate lines 121 including aplurality of gate electrodes 124 and a plurality of gate pads 129 areformed on the first insulation substrate 110. A gate insulating layer140 is formed on the gate lines 121. A plurality of semiconductors 154,a plurality of ohmic contacts 163 and 165, a plurality of data lines 171including a plurality of source electrodes 173 and a plurality of datapads 179, and a plurality of drain electrodes 175, are formed on thegate insulating layer 140. The first passivation layer 180 x and anorganic layer 80 are formed on the data lines 171 and the drainelectrodes 175. The organic layer 80 is not formed where the firstcontact holes 186, the second contact holes 187, and the third contactholes 185 are formed.

According to exemplary embodiments, the organic layer 80 may be thecolor filter 230, and the light blocking member 220 may be formed on orunder the color filter 230. The portion of the organic layer 80 disposedin association with a display area where a plurality of pixels aredisposed to display an image may be of a first thickness H1, which islarger than a second thickness H2 of the organic layer 80 disposed inassociation with a peripheral area, where the gate pads 129 or the datapads 179 are disposed. As previously mentioned, the organic layer 80 maybe omitted.

The first contact holes 186 exposing the gate pads 129 are formed in thefirst passivation layer 180 x and gate insulating layer 140 disposed inthe region not covered by the organic layer 80. The second contact holes187 exposing the data pads 179 and the third contact holes 185 exposingthe drain electrodes 175 are formed in the first passivation layer 180 xdisposed in the region not covered by the organic layer 80.

A plurality of pixel electrodes 191 disposed on the organic layer 80 andconnected to the drain electrodes 175 through the third contact holes185 are formed. The first contact assistants 96 covering the gate pads129 exposed through the first contact holes 186 are formed on the firstpassivation layer 180 x, and the second contact assistants 97 coveringthe data pads 179 exposed through the second contact holes 187 areformed on the first passivation layer 180 x. As previously mentioned,the pixel electrodes 191 and the first and second contact assistants 96and 97 may be formed any suitable transparent conductor.

As shown in FIGS. 29-33, the second passivation layer 180 y and thecommon electrode 270 are formed on the pixel electrode 191. This will bedescribed in more detail in association with FIGS. 38-57.

As shown in FIGS. 38-41, the first layer 10 made of (or otherwiseincluding) silicon nitride (SiNx) or silicon oxide (SiOx) is depositedon the first substrate 110 including the pixel electrodes 191, the firstand second contact assistants 96 and 97, and the second layer 20, eachof which may be made of any suitable transparent conductor, such as AZO,GZO, ITO, IZO, etc., is deposited on the first layer 10. A secondphotosensitive film 500 is deposited on the second layer 20.

Adverting to FIGS. 42-45, the second photosensitive film 500 is exposedand developed to form a third photosensitive film pattern 500 a. Thethird photosensitive film pattern 500 a is disposed in a region wherethe common electrode 270 will be formed, as will become more apparentbelow.

With reference to FIGS. 46-49, the second layer 20 is etched using thethird photosensitive film pattern 500 a as an etching mask to form thecommon electrode 270 having a plurality of first cutouts 271.

As shown in FIGS. 50-53, the third photosensitive film pattern 500 a isreflowed to form a fourth photosensitive film pattern 500 b. The fourthphotosensitive film pattern 500 b covers the first cutouts 271 of thecommon electrode 270 and the outer edge of the common electrode 270,seen in FIG. 53.

Adverting to FIGS. 54-57, the first layer 10 is etched using the fourthphotosensitive film pattern 500 b as an etching mask to form the secondpassivation layer 180 y including the protrusion 81 protruded from theouter edge of the common electrode 270. The first and second contactassistants 96 and 97 formed on the gate pads 129 and the data pads 179are exposed.

The fourth photosensitive film pattern 500 b is removed to form thelower panel 100.

As described above, after forming the lower panel 100, the upper panel200 is formed. The liquid crystal layer 3 is injected between the lowerand upper panels 100 and 200 to form the liquid crystal display shown inFIG. 29-FIG. 33.

According to exemplary embodiments, the common electrode 270 and thesecond passivation layer 180 y may be simultaneously formed, which maydecrease manufacturing time, cost, and complexity.

While certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the invention is not limited to suchembodiments, but rather to the broader scope of the presented claims andvarious obvious modifications and equivalent arrangements.

What is claimed is:
 1. A liquid crystal display, comprising: asubstrate; a gate line comprising a gate pad, the gate line beingdisposed on the substrate; a data line comprising a data pad, the dataline being disposed on the substrate; a thin film transistor connectedto the gate line and the data line; an organic layer disposed on thethin film transistor; a pixel electrode disposed on the organic layer; afirst contact assistant disposed on the gate pad; a second contactassistant disposed on the data pad; a first insulating layer disposed onthe pixel electrode; and a common electrode disposed on the firstinsulating layer, the common electrode overlapping with the pixelelectrode, wherein: the common electrode comprises first cutouts, thefirst insulating layer comprises second cutouts, the plane shapes of thefirst cutouts and the second cutouts are substantially the same, and thepixel electrode comprises a polycrystalline transparent conductivematerial.
 2. The liquid crystal display of claim 1, wherein: the organiclayer is a color filter.
 3. The liquid crystal display of claim 2,further comprising: a light blocking member disposed on the substrate.4. A liquid crystal display, comprising: a substrate; a gate linecomprising a gate pad, the gate line being disposed on the substrate; adata line comprising a data pad, the data line being disposed on thesubstrate; a thin film transistor connected to the gate line and thedata line; an organic layer disposed on the thin film transistor; apixel electrode disposed on the organic layer; a first contact assistantdisposed on the gate pad; a second contact assistant disposed on thedata pad; a first insulating layer disposed on the pixel electrode; anda common electrode disposed on the first insulating layer, the commonelectrode overlapping with the pixel electrode, wherein the commonelectrode comprises first cutouts, and wherein the edge of the firstinsulating layer is protruded from the edge of the common electrode. 5.The liquid crystal display of claim 4, wherein: the edge of the firstinsulating layer is protruded from the edge of the common electrode byabout half the width of a first cutout of the first cutouts.
 6. Theliquid crystal display of claim 5, wherein: the organic layer is a colorfilter.
 7. The liquid crystal display of claim 6, further comprising: alight blocking member disposed on the substrate.
 8. The liquid crystaldisplay of claim 4, wherein: the organic layer is a color filter.
 9. Theliquid crystal display of claim 8, further comprising: a light blockingmember disposed on the substrate.
 10. A method of manufacturing adisplay, comprising: forming a gate line comprising a gate pad and adata line comprising a data pad on a substrate; forming an organic layeron the gate line and the data line; forming a pixel electrode on theorganic layer, a first contact assistant on the gate pad, and a secondcontact assistant on the data pad; annealing the pixel electrode, thefirst contact assistant, and the second contact assistant to form apolycrystalline material; depositing a first layer comprising aninsulating material on the pixel electrode, the first contact assistant,and the second contact assistant; depositing a second layer comprising atransparent conductive material on the first layer; forming a firstphotosensitive film pattern comprising different thicknesses indifferent regions thereof; etching the second layer and the first layerusing the first photosensitive film pattern as an etching mask to exposeat least a portion of the first contact assistant and the second contactassistant; partially removing the first photosensitive film pattern toform a second photosensitive film pattern; and etching the second layerand the first layer using the second photosensitive film pattern as anetching mask to form a common electrode comprising first cutouts and afirst insulating layer comprising second cutouts.
 11. The method ofclaim 10, wherein forming the organic layer comprises: forming a colorfilter on the substrate.
 12. The method of claim 11, further comprising:forming a light blocking member on the first substrate.
 13. A method ofmanufacturing a liquid crystal display, comprising: forming a gate linecomprising a gate pad and a data line comprising a data pad on asubstrate; forming an organic layer on the gate line and the data line;forming a pixel electrode on the organic layer, a first contactassistant on the gate pad, and a second contact assistant on the datapad; depositing a first layer comprising an insulating material on thepixel electrode, the first contact assistant, and the second contactassistant; depositing a second layer comprising a transparent conductivematerial on the first layer; forming a first photosensitive film patternon the second layer; etching the second layer using the firstphotosensitive film pattern as an etching mask to form a commonelectrode comprising first cutouts; reflowing the first photosensitivefilm pattern to form a second photosensitive film pattern covering thefirst cutouts and an outer edge of the common electrode; and etching thefirst layer using the second photosensitive film pattern as an etchingmask to: form a first insulating layer protruded from the edge of thecommon electrode, and expose at least a portion of the first contactassistant and the second contact assistant.
 14. The method of claim 13,wherein: the edge of the first insulating layer is protruded from theedge of the common electrode by about half the width of a first cutoutof the first cutouts.
 15. The method of claim 14, wherein forming theorganic layer comprises: forming a color filter on the substrate. 16.The method of claim 15, further comprising: forming a light blockingmember on the substrate.
 17. The method of claim 13, wherein forming theorganic layer comprises: forming a color filter on the substrate. 18.The method of claim 17, further comprising forming a light blockingmember on the substrate.
 19. The method of claim 10, wherein the firstand second cutouts are shaped substantially similar to one another anddisposed in association with one another.